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Technical Overview: AMAT 0021-26609 Chamber Shield Component

From: | Author:Huang | Time :2025-05-19 | 218 Browse: | Share:

Technical Overview: AMAT 0021-26609 Chamber Shield Component

Designed with durability and optimal performance in mind, the 0021-26609 shield helps reduce maintenance requirements and extend the operational life of the process chamber. Its specific design features optimize particle control, thermal management, and process uniformity in demanding semiconductor manufacturing environments.

Technical Specifications

FeatureSpecification
Part Number0021-26609
ManufacturerApplied Materials (AMAT)
Component TypeChamber Shield
MaterialHigh-grade stainless steel with proprietary coating
CompatibilitySelect AMAT semiconductor processing platforms
Operating Temperature Range-50°C to +350°C
Surface TreatmentPrecision machined, electropolished
DimensionsApplication-specific (See equipment documentation)

Key Features & Benefits

Enhanced Deposition Control

Strategic design minimizes unwanted film deposition on chamber walls, reducing contamination risks and extending maintenance intervals.

Thermal Management

Engineered for optimal thermal performance to maintain process stability during temperature fluctuations inherent in semiconductor manufacturing.

Plasma Resistance

Surface treatments and material composition minimize erosion and sputtering when exposed to plasma environments.

Precision Machined

Manufactured to exacting tolerances to ensure proper fit and functionality within the process chamber system.

Particle Reduction

Design features minimize particle generation during thermal cycling and operation, critical for maintaining high yields.

Extended Lifespan

Specialized materials and coatings provide extended operational life compared to standard components, reducing costly consumable replacements.

Applications & Equipment Compatibility

The AMAT 0021-26609 chamber shield component is designed for use in advanced semiconductor manufacturing processes including:

  • Physical Vapor Deposition (PVD)

  • Chemical Vapor Deposition (CVD)

  • Plasma-Enhanced Chemical Vapor Deposition (PECVD)

  • Etching Processes

  • Ion Implantation

Equipment Compatibility

This component is specifically designed for integration with the following Applied Materials equipment platforms:

  • Endura® PVD Systems

  • Centura® Processing Platforms

  • Producer® PECVD Systems

  • Other compatible AMAT chamber configurations

Always verify compatibility with your specific equipment model and configuration by consulting the equipment documentation or contacting an authorized supplier.

Installation Guidelines

Pre-Installation Checklist

  1. Verify part compatibility with your specific equipment model

  2. Ensure all safety protocols are followed including proper lockout/tagout procedures

  3. Gather necessary tools and equipment for installation

  4. Prepare a clean workspace to prevent contamination

  5. Have the equipment manual available for reference

  6. Inspect the new component for any shipping damage or defects

Installation Steps

  1. Ensure the chamber is fully cooled and vented to atmosphere

  2. Follow the equipment-specific procedures for accessing the chamber

  3. Remove any securing hardware from the existing shield component

  4. Carefully extract the old shield component, noting its orientation and mounting points

  5. Clean mounting surfaces according to equipment specifications

  6. Install the new 0021-26609 shield component, taking care to maintain proper alignment

  7. Verify proper seating and alignment before securing

  8. Reinstall all fasteners to the specified torque settings

  9. Perform a visual inspection to ensure proper installation

  10. Follow standard equipment restart procedures

Important Safety Considerations

Working with semiconductor manufacturing equipment requires specialized training and knowledge. Always follow proper safety protocols, including ESD (Electrostatic Discharge) prevention measures when handling components. Ensure all chamber surfaces are at safe temperatures before attempting installation. Only qualified personnel should perform maintenance on manufacturing equipment.

Maintenance & Cleaning

Regular maintenance of the chamber shield component is essential for optimal equipment performance:

  • Inspect the shield surface for signs of excessive deposition, erosion, or damage during scheduled maintenance intervals

  • Clean according to material-specific protocols - typically involving approved solvents and non-abrasive methods

  • Verify all mounting hardware is secure and undamaged

  • Check shield alignment and position after thermal cycling

  • Document the condition of the component for lifecycle tracking

  • Replace the shield when wear exceeds manufacturer specifications

Cleaning Protocol

When cleaning the 0021-26609 shield, use only approved semiconductor-grade solvents and follow clean room protocols. Avoid abrasive materials that could damage surface treatments or coatings. For stubborn deposits, consult the equipment manual for recommended cleaning methods specific to the deposited materials.

Troubleshooting Common Issues

IssuePossible CausesRecommended Solutions
Process DriftShield surface contamination, improper installation, thermal expansion issuesVerify shield positioning, clean according to protocol, check for warping
Particle GenerationShield damage, loose mounting, material degradationInspect shield surface, verify torque on mounting hardware, replace if damaged
Increased Deposition on Chamber WallsShield misalignment, wear beyond specificationsVerify shield positioning, inspect for gaps or wear, replace if necessary
Uneven Process ResultsThermal gradients from shield damage, coating issuesPerform detailed visual inspection, verify thermal properties, replace if damaged
Reduced Equipment UptimeAccelerated shield wear, improper maintenanceImplement regular inspection protocols, verify process conditions are within specifications
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