Honeywell TDC‑3000 DI Digital Input IOP 51304485‑100 MC‑PDIX02



TDC‑3000 DI Digital Input IOP 51304485‑100 MC‑PDIX02

caused by Electrostatic Discharge (ESD) only while installed in the system module, or

packed inside the conductive plastic bag in which they are shipped.  To avoid ESD damage

when the card is handled outside its enclosure, to guard against electrical overstress, and to

maintain personnel safety, the following practices and procedures must be followed:

• Turn off power to the module before removing or inserting the card.

• Handle the card only by its edges.  Do not touch the printed wire board runs,

connectors, or components unless you are wearing a grounded wrist-strap and the

card is on a conductive work-surface.

• When applying power to the system before installation is complete, terminate all

loose wires within the cabinet or console.  Make sure power is off when doing any

wiring work.

• ESD-generating materials, such as plastic, rubber, nylon, polyester, vinyl, silk, or

synthetic materials or garments, should not be allowed in the area of the cards.  If

you are wearing clothing of such material, you must stand on a grounded floor-mat

while wearing a grounded shoe-strap, or you must wear a grounded wrist-strap

while handling cards.  Note: take special care to always keep the cards away from

such material because static charges cannot be drained off, except by discharge.

• Do not carry unprotected cards across carpeting, unless it is grounded conductive

carpet such as conventional fiber with woven-in ground wires.  Always keep the

circuit card in its protective bag until it is actually needed.

• All test equipment and tools must be connected to the metal chassis or module frame

with a ground wire, before touching the card or internal wiring.

• Cards must be handled and transported to and from the job site in their protective

bags (see approved material list).

• Personnel must wear an approved wrist-strap connected to the chassis before

removing the card from its protective bag or card slot.

• When shipping a suspected defective card, pack it in its protective bag before

placing it in the shipping carton.  Note that cards must be protected against further

damage so that failure analysis can be accomplished.

• Do not use standard Bubble Pack mailers.

• Do not allow unprotected cards to come in contact with Styrofoam packing material.

For additional ESD information, refer to the LCN Planning manual in the System Site

Planning - 1 binder