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AMAT 0040-54755 Ceramic ESC Series

From: | Author:Huang | Time :2025-05-16 | 142 Browse: | Share:

AMAT 0040-54755 Ceramic ESC Series

Advanced Semiconductor Manufacturing Components

Technical Overview: AMAT 0040-54755 Series

The Applied Materials (AMAT) 0040-54755 CERAMIC ESC is a high-performance electrostatic chuck designed specifically for 200mm DPS II SNNF (Sub-Zero No Notch Finder) semiconductor processing chambers. This technical article examines the specifications, applications, compatibility, and related models within this crucial component series used in advanced semiconductor manufacturing processes.

AMAT 0040-54755 Ceramic ESC Component

Product Specifications and Features

The AMAT 0040-54755 CERAMIC ESC is a critical component in the Applied Materials semiconductor equipment ecosystem, specifically designed for DPS (Decoupled Plasma Source) II chambers. Below are the key specifications and features:

SpecificationDetails
Part Number0040-54755
Component TypeCeramic Electrostatic Chuck (ESC)
Wafer Size Compatibility200mm (8-inch)
Chamber CompatibilityDPS II SNNF
MaterialAdvanced Ceramic (AlN)
Design TypeMonopolar/Bipolar Configuration
ApplicationMetal/Poly Etch Processes
Temperature Range-20°C to +80°C (Operational)

Enhanced Thermal Management

The ceramic construction provides superior thermal conductivity and temperature uniformity across the wafer surface, ensuring consistent process results even in extreme temperature conditions required for sub-zero processing.

Improved Particle Control

The advanced ceramic design reduces particle generation and contamination risks, minimizing defects and increasing yield in semiconductor production environments.

Extended Operational Lifetime

Compared to traditional polyimide ESC designs, the ceramic construction offers longer service intervals and improved resistance to plasma erosion, reducing the total cost of ownership.

Technical Applications

The AMAT 0040-54755 Ceramic ESC is primarily utilized in the following semiconductor fabrication processes:

Metal Etching Applications

The DPS II chamber equipped with the 0040-54755 Ceramic ESC is designed for precise metal etching processes, including:

  • Aluminum and aluminum alloy etching

  • Copper interconnect formation

  • Tungsten etching for contacts and vias

  • Titanium and titanium nitride barrier layer processing

Poly Silicon Etching

The 0040-54755 ESC provides critical wafer control during poly silicon etching processes, delivering:

  • Precise critical dimension (CD) control

  • Excellent etch uniformity across 200mm wafers

  • Enhanced profile control for high aspect ratio features

  • Reduced microloading effects during complex etching sequences

Key Advantage: The SNNF (Sub-Zero No Notch Finder) configuration allows for processing at sub-zero temperatures without requiring a mechanical notch-finding mechanism, simplifying the chamber design while maintaining precise wafer positioning.

Related Models and Compatibility

The 0040-54755 belongs to a family of ceramic ESC components designed for various AMAT chamber configurations. Compatible and related part numbers include:

Part NumberDescriptionChamber Compatibility
0040-41924Ceramic Coated ESC ASSY, 200MM SNNFDPS HT CATHODE
0040-77771Polyimide ESC (Predecessor)DPS Metal Etch
0040-35869ESC AssemblyDPS Poly Etch
0020-39087ESC Component200mm Metal Etch
0010-15668Dual Zone Ceramic ESCDPS+ Metal/Poly
0010-93181Advanced Ceramic ESCDPS+ Enhanced

Equipment Integration

The 0040-54755 Ceramic ESC is designed for integration with the following Applied Materials equipment platforms:

  • Centura DPS II Etching Systems

  • Producer Platforms with DPS II Module configurations

  • Legacy Precision 5000 systems with appropriate retrofits

  • Enabler platforms with compatible chamber configurations

Technical Advantages Over Predecessor Designs

The ceramic ESC technology represented by the 0040-54755 series offers significant advantages over previous polyimide-based ESC designs:

Performance MetricCeramic ESC (0040-54755)Polyimide ESC (Legacy)
Temperature Uniformity±1.5°C across wafer±3.0°C across wafer
Particle GenerationMinimal particle sheddingSubject to polyimide breakdown
RF Power HandlingSuperior high-power capabilityLimited by dielectric breakdown
Lifetime Expectancy2-3x improvementBaseline
MicroarcingEliminatedCommon issue
Wafer StickingSignificantly reducedFrequent issue requiring maintenance

Engineering Note: The AMAT 0040-54755 Ceramic ESC utilizes a coulombic design principle rather than the Johnson-Rahbeck effect used in some other ESC designs, providing more consistent clamping force and reduced wafer damage during processing.

Maintenance and Service Considerations

To maximize the operational life and performance of the AMAT 0040-54755 Ceramic ESC, the following maintenance procedures are recommended:

Preventive Maintenance Schedule

  • Visual inspection of ceramic surface every 1,000 wafer cycles

  • RF connection integrity verification every 5,000 wafer cycles

  • Helium leak testing at 3-month intervals

  • Complete electrical testing at 6-month intervals

  • Temperature calibration verification quarterly

Common Replacement Indicators

  • Visible chipping or cracking of the ceramic surface

  • Degradation in temperature uniformity across wafers

  • Increased helium leakage rates during processing

  • Inconsistent wafer clamping or declamping behavior

  • Visible plasma damage or erosion patterns

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