EMERSONOvation™ VHF Power Delivery System Leading power technology to enable advanced dielectric etch and PVD processes

Benefits

Broadens process windows

Expands process capabilities

Improves plasma characteristics

Increases etch rate, selectivity, 

and uniformity

Reduces CoO 

The Ovation™ fully integrated, VHF power delivery system enables faster, higher 

precision for demanding narrow-linewidth dielectric etch processes. It is the first to 

accurately deliver power into a non-50-Ω environment without an external sensor, 

reacting faster than traditional power supplies. The 60-MHz power delivery reduces 

voltage potential across the plasma sheath, minimizing ion etch damage, and thus 

improving film quality and yields. Its embedded measurement technology enables 

previously unavailable insight into chamber plasma parameters and performance.

Features

2760 W, 60 MHz (contact factory 

for higher power requirements)

Sweep frequency

Non-50 Ω measurement 

capability 

Analog, RS-232, and Ethernet 

control options 

Smaller footprint—half-rack 

option for power up to 2.7 kW

Highly stable and reliable

Expert applications support

Improves Film 

Quality and Yields

As process geometries continue to 

shrink with decreasing metal widths 

and line spaces, the Advanced Energy®

Ovation VHF power-delivery system 

offers an innovative solution to help 

you achieve desirable properties in sub90-nm dielectric etch, HDP-CVD, and 

PECVD processes. Critical dimensions 

and narrow linewidths require 

stable and accurate power-delivery 

systems with higher-than-traditional 

frequencies. The unique technology 

in the Ovation power-delivery system 

allows you to optimize your processes 

with enhanced VHF power delivery 

and measurement. Further, 60-MHz 

technology reduces voltage potential 

across the plasma sheath, minimizing 

ion etch damage and thus improving 

film quality and yields.

Broadens Process 

Windows 

This advanced, very high frequency 

power technology enables you to 

expand your process window over 

a wide VSWR load range with output 

powers up to 4.5 kW at frequencies 

of 60 MHz. 

Developed to meet the demanding 

requirements of advanced etch 

processes, the Ovation VHF powerdelivery system accurately and 

efficiently delivers the optimal power 

required into a wide VSWR window, 

up to 3:1. The system’s unique powerdelivery scheme offers the highest 

power efficiency and power density 

commercially available—in a compact, 

half-rack unit—nearly half the size 

of competing systems for power 

requirements up to 2.7 kW.

Expands Process Capabilities

The Ovation system’s power platform ensures stable performance, reliable 

operation, improved overall film characteristics, and increased yields—

even at the 65-nm range.

Expanded process capabilities include:

• Quick power system compensation for plasma load changes due 

to process step transitions

• Accurate measurement and power delivery outside of 50 Ω

The Ovation power system is specifically designed to expand the tight process 

windows constraining advanced etch processes by providing the capabilities 

for users to drive higher plasma densities, with a wide operating range and 

unmatched transient response.

Improves Plasma Characteristics

To avoid device damage, as smaller gate structures become the norm, processes 

must run at lower-than-traditional voltages. High-frequency power systems readily 

enable these low-voltage processes. Process developers who contend with these issues 

have found that high-frequency systems provide such tangible benefits as:

• Increased plasma density for etch and CVD applications

• Reduced process-induced damage in etch applications 

Higher Etch Selectivity 

and Etch Rates

Today’s demanding, narrow-linewidth, 

dielectric etch processes require rapid 

power supply responses to transitions 

between process steps. The Ovation 

power-delivery solution ensures 

consistent and repeatable performance. 

Its VHF power-delivery system is the 

first to accurately deliver power into a 

non-50-Ω environment, allowing the 

Ovation generator to react faster than 

traditional power supplies.

This fully integrated power-delivery 

system enables faster, higherprecision processes such as those 

required for sub-90- and sub-65-

nm etch applications, through the 

implementation of a unique powerdelivery scheme. This scheme results in:

• Higher etch rates

• Higher yields and film quality 

on processes with precision control 

between transition process steps

• More efficient power transfer

Enhanced Power 

Measurement System

The Ovation power-delivery 

solution features embedded advanced 

measurement technology, including 

internal impedance measurement. 

A non-50-Ω measurement capability 

facilitates previously unavailable 

insights into chamber plasma 

parameters and performance. 

The system also offers embedded 

power instrumentation for 

real-time data mining

Optional Equipment

Compact and Versatile for 

Any Process Environment

The Ovation system is compact 

in size for easy installation and 

seamless integration into your new 

or existing processes. The small 

product footprint maximizes your 

chamber design flexibility.

Communication Options

This power-delivery system offers an 

array of interfacing options, including 

analog and RS-232 (AE Bus) interfaces. 

RS-232 interfaces, when used with 

the optional AE® Virtual Front Panel 

(VFP) software package, allow data 

visualization of many internal source 

parameters and fault conditions.

Reliability & Compliance

The Ovation power-delivery 

system has received the following 

safety certifications:

• CE 73/23/EEC & 89/336/EEC

• IEC/EN 61010-1

• CSA C22.2 No. 1010.1

• ANSI/ISA-82.02.01

• NRTL/C

• SEMI F47

• EN 55011, EN61326, and 47 CFR

Value-Added Options

Virtual Front Panel

AE’s optional VFP graphical computer 

interface gives you the ability to 

perform critical functions dynamically, 

and in real time, including:

• Process setup

• Troubleshooting

• Operational control

• Data visualization

Navigator™ Matching Network

Advanced Energy’s Navigator™

matching network provides advanced 

match technology for rapid, accurate, 

and reliable matching from an 

RF generator to the processing 

tool across a wide range of load 

impedances. This versatile matching 

network optimizes delivered power 

to semiconductor, flat panel display, 

and MEMs manufacturing processes, 

including CVD, HDP-CVD, and 

chamber clean applications. Equipped 

with microprocessor-controlled 

stepper motor circuitry and digital, 

user-selectable tuning algorithms, 

the Navigator matching network 

minimizes reflected power by 

automatically tuning the complex 

impedance of a coupled plasma. The 

network’s digital scheme delivers 

superior performance over traditional 

analog-based tuning methods, which 

are less consistent and accurate. An 

optional, internal Z’Scan® RF sensor 

provides real-time measurement 

and analysis of process power 

and impedance, enabling process 

engineers to identify and significantly 

reduce process variability—a 

competitive advantage over other 

matching networks without real-time 

monitoring capability. In addition, the 

Navigator matching network features 

embedded instrumentation that 

permits process engineers to exercise a 

level of electrostatic chuck control and 

a level of process-recipe optimization 

not possible with non-embedded, 

separate instrumentation. Moreover, 

with AE’s VFP software, process 

engineers can monitor and command 

the matching network through a 

personal computer—enabling a level 

of control not previously available.

Sweep Frequency

The Ovation 3060 sweep frequency 

incorporates direct digital synthesis 

(DDS) technology for control of 

its operating frequency when the 

power system is mismatched. This 

field-proven, robust technology has 

been incorporated into AE products 

since 1996. The frequency can be 

programmed to dither over a predetermined range, enable plasma 

ignition, and minimize the mismatch 

to the power system during plasma 

processing. The DDS operating 

parameters can be set via an RS232 or Ethernet port and are stored 

indefinitely in non-volatile RAM.

General Specifications

Physical

Size

Up to 2.7 kW 16.5 cm (H) x 24.0 cm (W) x 59.7 cm (D)

6.5" (H) x 9.45" (W) x 23.5" (D)

(Does not include connectors and handles)

Above 4.5 kW 19.5 cm (H) x 43.9 cm (W) x 64.4 cm (D)

7.68" (H) x 17.30"(W) x 25.35" (D)

(Does not include connectors and handles)

Weight < 29.5 kg (65 lb) max for power up to 2.7 kW

< 65.9 kg (145 lb) max for powers higher than 2.7 kW

RF Output Connector Type HN female at 2.7 kW/ QRM F for 4.5 kW

User Interface Connector 25-pin, sub-D, female

Remote Digital Interface 

(AE Bus)

9-pin, sub-D, female

Electrical

Input Power 

Line Voltage 180 to 229 VAC (208 V nominal), 3 Φ, 4-wire, no neutral connection required

Line Frequency 50/60 Hz

RF Output 

Full-Rated Output Power 2.7 to 4.5 kW, depending on model

Accuracy +3% or 20 W, whichever is greater

Optional V and I Outputs Available for non-50-Ω power measurement

Frequency 60 MHz