AMAT 0101-57065 high-precision Ion Implanter Component
Applied Materials (AMAT) 0101-57065 is a high-precision Ion Implanter Component, specifically identified as a Filament Assembly or Ion Source Hardware used in the Gloucester-designed ion implantation systems.
These systems are essential for the "doping" process in semiconductor fabrication, where ions are accelerated into silicon wafers to modify their electrical properties.
The 0101-57065 is a critical consumable/spare part that ensures the stable generation of the ion beam.
Technical Parameter Table
| Parameter | Specification |
| Manufacturer | Applied Materials (AMAT) |
| Part Number | 0101-57065 |
| Component Type | Ion Source Filament / Cathode Assembly |
| Material Composition | Tungsten (W) or Tantalum (Ta) |
| Compatible Systems | VIISta Series (80, 810, HCP, Trident) |
| Operating Vacuum | $< 1 times 10^{-6}$ Torr |
| Current Rating | High-current thermal emission optimized |
| Weight | Approx. $0.05$ kg |
Related Models
The 0101-57065 is typically part of a larger source head assembly and is often purchased alongside:
0101-57064: Anode/Cathode insulator set.
0190-20101: Ion Source Power Supply Controller.
0010-75332: Source Head Reconstruction Kit.
0101-57066: Repeller plate for ion beam shaping.
Application Cases
This component is used exclusively in the Ion Implantation phase of chip manufacturing:
Dopant Ionization: Used to create the plasma from which boron, phosphorus, or arsenic ions are extracted.
High-Current Implantation: Critical for high-dose "Source/Drain" doping where beam stability is paramount.
Refurbishment: A standard replacement part during "Source PM" (Preventative Maintenance) cycles in global 200mm and 300mm wafer fabs.
Product Advantages and Features
High Thermal Stability: Engineered to withstand the extreme temperatures ($> 2000^circ C$) required for thermionic emission without premature warping.
Beam Uniformity: Precisely machined dimensions ensure consistent ion beam density across the wafer surface, improving yield.
Contamination Control: Manufactured using ultra-high-purity materials to prevent metallic contamination of the silicon substrate.
Extended Life-Cycle: Optimized filament geometry reduces "thinning" over time, extending the intervals between tool shutdowns.
Other Models in the Same Series
0101-57060: Low-energy ion source filament.
0101-58000 series: Advanced EHC (Electron Hole Compensation) components.
0101-57070: Specialized high-temperature cathode.
Installation and Maintenance
Maintenance Warning: Ion source components may contain toxic dopant residues (Arsine/Phosphine). Always use appropriate PPE and a ventilated fume hood during replacement.
Installation: Align the filament pins precisely with the ceramic insulators. Over-tightening the set screws can cause the ceramic to crack, while under-tightening leads to high-resistance "hot spots."
| TRICON | 4000056-006 |
| TRICON | 4000103-510 |
| TRICON | 4000163-510 |
| TRICON | 4000164-520 |
| TRICON | 4101 |
| TRICON | 4107 |
| TRICON | 4118 |
| TRICON | 4119 |
| TRICON | 4119A |
| TRICON | 4328 |
| TRICON | 4329 |
| TRICON | 4400 |
| TRICON | 4500 |
| TRICON | 4507 |
| TRICON | 4609 |
| TRICON | 8312 |
| TRICON | 9651-110 |
| TRICON | 9668-110 |
Burn-in: Following installation, the system should follow a controlled "ramp-up" procedure to outgas the filament before applying full extraction voltage.
Cleaning: Do not use liquid cleaners on the 0101-57065. If reuse is necessary, light abrasive cleaning of the contact points with an ESD-safe pad is recommended.
Unique Product Description
The AMAT 0101-57065 is the "spark" of the ion implantation tool.
In the ultra-precise world of semiconductor doping, the stability of the ion source determines the success of the entire wafer batch.
This filament assembly is designed to provide a steady, flicker-free stream of ions under intense thermal and vacuum conditions.
While seemingly a simple hardware piece, its metallurgical purity and geometric precision are what allow modern fabs to achieve the nanometer-scale accuracy required for the latest generation of logic and memory chips.
| User name | Member Level | Quantity | Specification | Purchase Date |
|---|