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AMAT  0101-57065  high-precision Ion Implanter Component
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AMAT 0101-57065 high-precision Ion Implanter Component

AMAT  0101-57065  high-precision Ion Implanter Component

4570.00
¥3560.00
¥3560.00
¥3560.00
Weight:2.000KG
Description

AMAT  0101-57065  high-precision Ion Implanter Component


Applied Materials (AMAT) 0101-57065 is a high-precision Ion Implanter Component, specifically identified as a Filament Assembly or Ion Source Hardware used in the Gloucester-designed ion implantation systems.

These systems are essential for the "doping" process in semiconductor fabrication, where ions are accelerated into silicon wafers to modify their electrical properties.

The 0101-57065 is a critical consumable/spare part that ensures the stable generation of the ion beam.

 Technical Parameter Table

ParameterSpecification
ManufacturerApplied Materials (AMAT)
Part Number0101-57065
Component TypeIon Source Filament / Cathode Assembly
Material CompositionTungsten (W) or Tantalum (Ta)
Compatible SystemsVIISta Series (80, 810, HCP, Trident)
Operating Vacuum$< 1 times 10^{-6}$ Torr
Current RatingHigh-current thermal emission optimized
WeightApprox. $0.05$ kg

 Related Models

The 0101-57065 is typically part of a larger source head assembly and is often purchased alongside:

0101-57064: Anode/Cathode insulator set.

0190-20101: Ion Source Power Supply Controller.

0010-75332: Source Head Reconstruction Kit.

0101-57066: Repeller plate for ion beam shaping.

 Application Cases

This component is used exclusively in the Ion Implantation phase of chip manufacturing:

Dopant Ionization: Used to create the plasma from which boron, phosphorus, or arsenic ions are extracted.

High-Current Implantation: Critical for high-dose "Source/Drain" doping where beam stability is paramount.

Refurbishment: A standard replacement part during "Source PM" (Preventative Maintenance) cycles in global 200mm and 300mm wafer fabs.

 Product Advantages and Features

High Thermal Stability: Engineered to withstand the extreme temperatures ($> 2000^circ C$) required for thermionic emission without premature warping.

Beam Uniformity: Precisely machined dimensions ensure consistent ion beam density across the wafer surface, improving yield.

Contamination Control: Manufactured using ultra-high-purity materials to prevent metallic contamination of the silicon substrate.

Extended Life-Cycle: Optimized filament geometry reduces "thinning" over time, extending the intervals between tool shutdowns.

 Other Models in the Same Series

0101-57060: Low-energy ion source filament.

0101-58000 series: Advanced EHC (Electron Hole Compensation) components.

0101-57070: Specialized high-temperature cathode.

 Installation and Maintenance

Maintenance Warning: Ion source components may contain toxic dopant residues (Arsine/Phosphine). Always use appropriate PPE and a ventilated fume hood during replacement.

Installation: Align the filament pins precisely with the ceramic insulators. Over-tightening the set screws can cause the ceramic to crack, while under-tightening leads to high-resistance "hot spots."

TRICON4000056-006
TRICON4000103-510
TRICON4000163-510
TRICON4000164-520
TRICON4101
TRICON4107
TRICON4118
TRICON4119
TRICON4119A
TRICON4328
TRICON4329
TRICON4400
TRICON4500
TRICON4507
TRICON4609
TRICON8312
TRICON9651-110
TRICON9668-110

Burn-in: Following installation, the system should follow a controlled "ramp-up" procedure to outgas the filament before applying full extraction voltage.

Cleaning: Do not use liquid cleaners on the 0101-57065. If reuse is necessary, light abrasive cleaning of the contact points with an ESD-safe pad is recommended.

 Unique Product Description

The AMAT 0101-57065 is the "spark" of the ion implantation tool.

In the ultra-precise world of semiconductor doping, the stability of the ion source determines the success of the entire wafer batch.

This filament assembly is designed to provide a steady, flicker-free stream of ions under intense thermal and vacuum conditions.

While seemingly a simple hardware piece, its metallurgical purity and geometric precision are what allow modern fabs to achieve the nanometer-scale accuracy required for the latest generation of logic and memory chips.


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